Configurable heating device and method of using the same

ABSTRACT

A device includes a comparator configured to compare a transmission phase of light in a photonic component with a reference phase. The device further includes a heater configured to control a temperature of the photonic component. The heater includes a plurality of heater segments, and a plurality of switches, wherein each switch of the plurality of switches is between a pair of heater segments of the plurality of heater segments. The device further includes a controller configured to control operation of each switch of the plurality of switches based on results from the comparator for selectively connecting heater segments of the plurality of heater segments in series.

PRIORITY CLAIM

This application is a continuation of U.S. application Ser. No.15/663,489, filed Jan. 28, 2017, which claims the benefit of U.S.Provisional Application No. 62/525,561, filed Jun. 27, 2017, which areherein incorporated by reference in their entireties.

BACKGROUND

Photonic-electronic co-design system is realized by integrating photonicintegrated (PI) circuits to silicon substrates. The efficiency of thesignal transmission in photonic components is highly related to thewavelength of the light transmitted therein since the reflection powerof the light is dependent thereon. However, the wavelength is affectedby the ambient temperature that the photonic components locate.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is an exemplary diagram of a configurable heating device inaccordance with various embodiments of the present disclosure;

FIG. 2A is a diagram of a top view of the configurable heaterillustrated in FIG. 1, and a photonic component, in accordance withvarious embodiments of the present disclosure;

FIG. 2B is a diagram of a top view of two configurable heatersillustrated in FIG. 1, and a photonic component, in accordance withvarious embodiments of the present disclosure;

FIG. 3A is an exemplary diagram of the configurable heater illustratedin FIG. 1, in accordance with various embodiments of the presentdisclosure;

FIG. 3B is an exemplary diagram illustrating a part of the configurableheater in the dashed line frame in FIG. 3A in accordance with variousembodiments of the present disclosure;

FIG. 4 is an exemplary diagram illustrating a relation between the timeand the ambient temperature affected by a heater in accordance withvarious embodiments of the present disclosure;

FIG. 5A is an exemplary diagram illustrating another implementation ofthe configurable heater illustrated in FIG. 1, in accordance withvarious embodiments of the present disclosure;

FIG. 5B is an exemplary diagram illustrating yet another implementationof the configurable heater illustrated in FIG. 1, in accordance withvarious embodiments of the present disclosure;

FIGS. 6A-6C are exemplary cross-sectional diagrams illustrating theposition of the configurable heater illustrated in FIG. 1, relative to aphotonic component, in accordance with various embodiments of thepresent disclosure;

FIG. 7A and FIG. 7B are exemplary cross-sectional diagrams illustratingthe position of the heater segment illustrated in FIG. 3A, relative to aphotonic component, in accordance with various embodiments of thepresent disclosure; and

FIG. 8A is an exemplary diagram of the configurable heater illustratedin FIG. 1, in accordance with various embodiments of the presentdisclosure;

FIG. 8B is an exemplary diagram of the configurable heater illustratedin FIG. 1, in accordance with various embodiments of the presentdisclosure; and

FIG. 9 is a flow chart of a configuring method illustrating aconfiguring process of the configurable heating device illustrated inFIG. 1, in accordance with various embodiments of the presentdisclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

The terms used in this specification generally have their ordinarymeanings in the art and in the specific context where each term is used.The use of examples in this specification, including examples of anyterms discussed herein, is illustrative only, and in no way limits thescope and meaning of the disclosure or of any exemplified term.Likewise, the present disclosure is not limited to various embodimentsgiven in this specification.

It will be understood that, although the terms “first,” “second,” etc.,may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are used to distinguish oneelement from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the embodiments. As usedherein, the term “and/or” includes any and all combinations of one ormore of the associated listed items.

As used herein, the terms “comprising,” “including,” “having,”“containing,” “involving,” and the like are to be understood to beopen-ended, i.e., to mean including but not limited to.

Reference throughout the specification to “one embodiment” or “anembodiment” means that a particular feature, structure, implementation,or characteristic described in connection with the embodiment isincluded in at least one embodiment of the present disclosure. Thus,uses of the phrases “in one embodiment” or “in an embodiment” in variousplaces throughout the specification are not necessarily all referring tothe same embodiment. Furthermore, the particular features, structures,implementation, or characteristics may be combined in any suitablemanner in one or more embodiments.

FIG. 1 is an exemplary diagram of a configurable heating device 100 inaccordance with various embodiments of the present disclosure.

In some embodiments, the configurable heating device 100 is used in aphotonic-electronic co-design ecosystem (not illustrated). Thephotonic-electronic co-design ecosystem integrates photonic componentsand electronic components (not illustrated), in which at least one ofthe photonic components is configured to transmit signals in the form ofa light Lt having a transmission phase Pt. In some embodiments, thephotonic components are waveguides.

In some embodiments, the configurable heating device 100 is a part ofthe electronic components and is configured to perform feedback controlof light transmission in the photonic components of thephotonic-electronic co-design ecosystem.

For illustration in FIG. 1, the configurable heating device 100 includesa comparator 110, a controller 120 and a configurable heater 130.

The comparator 110 is configured to compare the transmission phase Pt ofthe light Lt transmitted in the photonic component with a referencephase Pr of a reference light Lr to generate a phase difference ΔP.

In some embodiments, the phase difference ΔP is expressed by thefollowing equation: ΔP=Pt−Pr. In some embodiments, the phase differenceΔP is generated by the comparator 110 in the form of an electricalcurrent.

The controller 120 is configured to generate a combination or a group ofcontrol signals CS based on the phase difference ΔP to control theconfigurable heater 130. For illustration, each phase difference ΔPcorrespond to multiple control signals CS, and the control signals CSare configured for controlling the configurable heater 130 to have acorresponding configuration. The amount of heat H generated by theconfigurable heater 130 depends on the configuration of the configurableheater 130. Accordingly, different configurations of the configurableheater 130 result in different amounts of heat H. In some embodiments,the controller 120 generates the combination of control signals CS byusing a look-up table (not shown).

The configuration of the configurable heating device 100 illustrated inFIG. 1 is given for illustrative purposes. Various configurations of theconfigurable heating device 100 are within the contemplated scope of thepresent disclosure.

FIG. 2A is a diagram of a top view of the configurable heater 130illustrated in FIG. 1, and a photonic component 200, in accordance withvarious embodiments of the present disclosure.

In some embodiments, the configurable heater 130 is disposed neighboringto the photonic component 200. The photonic component 200 is a ringcoupler, which, in some embodiments, is implemented by a photoniccoupler having two transmission lines 205 and 210 and a ring-shapedtransmission line 215 that is disposed between the transmission lines205 and 210, as illustrated in FIG. 2A. In some embodiments, theconfigurable heater 130 is disposed inside the ring-shaped transmissionline 215. For illustration, one of the transmission lines 205 and 210couples energy to the other one of the transmission lines 205 and 210through the ring-shaped transmission line 215.

FIG. 2B is a diagram of a top view of two configurable heaters 130illustrated in FIG. 1, and a photonic component 220, in accordance withvarious embodiments of the present disclosure.

In some embodiments, the configurable heaters 130 are disposedneighboring to the photonic component 220. The photonic component 220 isa cross coupler, which, in some embodiments, is implemented by aphotonic coupler having two transmission lines 225 and 230, asillustrated in FIG. 2B. In some embodiments, two configurable heaters130 are disposed at one side of the transmission line 225 and one sideof the transmission line 230, respectively. For illustration, one of thetransmission lines 225 and 230 couples energy to the other one of thetransmission lines 225 and 230.

As illustratively shown in FIG. 2A and FIG. 2B, each of the configurableheaters 130 provides heat to the environment that the photonic component200 or the photonic component 220 locates. The ambient temperature ofthe environment increases when more heat is generated by theconfigurable heaters 130. On the contrary, the ambient temperature ofthe environment decreases when less heat is generated by theconfigurable heaters 130.

In some embodiments, the wavelength of the light Lt transmitted in thephotonic component increases when the ambient temperature increases.Moreover, the reflection power in the photonic component is highlydependent on the wavelength of the light Lt transmitted in the photoniccomponent. In some embodiments, a peak of the reflection powercorresponds to a specific value of the wavelength.

In some embodiments, the phase difference ΔP reflects a differencebetween the wavelength of the light Lt transmitted in the photoniccomponent and a target wavelength corresponding to the peak of thereflection power. As a result, based on the phase difference ΔP, theconfigurable heater 130 is controlled to provide different amount ofheat to the environment that the photonic component locates in order tomodify the wavelength of the light Lt to meet the target wavelength.

More specifically, under a condition that the phase difference ΔPindicates that the wavelength of the light Lt transmitted in thephotonic component is smaller than the target wavelength, when the phasedifference ΔP increases, the controller 120 generates a combination ofthe control signals CS according to the phase difference ΔP, and such acombination of the control signals CS controls the configurable heater130 to provide relatively more amount of heat to the photonic component,in order to rapidly increase the ambient temperature.

On the other hand, under the condition that the phase difference ΔPindicates that the wavelength of the light Lt transmitted in thephotonic component is larger than the target wavelength, when the phasedifferent ΔP increases, the controller 120 generates a combination ofthe control signals CS according to the phase difference ΔP, and such acombination of the control signals CS adjusts the configuration of theconfigurable heater 130 to provide less amount of heat to the photoniccomponent to rapidly decrease the ambient temperature.

The number and the position of the configurable heater 130 relative tothe photonic component in FIG. 2A and FIG. 2B are given for illustrativepurposes. Various numbers and the positions of the configurable heater130 are within the contemplated scope of the present disclosure.

The configuration and the configuring mechanism of the configurableheater 130 is described in detail in the following paragraphs inaccompanied with FIG. 3A and FIG. 3B.

FIG. 3A is an exemplary diagram of the configurable heater 130illustrated in FIG. 1, in accordance with various embodiments of thepresent disclosure.

The configurable heater 130 includes a plurality of heater segments 300.As illustratively shown in FIG. 3A, the heater segments 300 are stripsdisposed parallel to each other. In some embodiments, the first one ofthe heater segments 300 is electrically coupled to a current source 320.In some embodiments, the material of the heater segments 300 includesmetal, and each one of the heater segments 300 operates to generate heatwhen a current I1 from the current source 320 flows through eachcorresponding heater segment 300, as illustrated in FIG. 3A.

The configurable heater 130 further includes a plurality of switches310. Each one of the switches 310 is disposed between a pair of theheater segments 300. In some embodiments, the control signals CSillustrated in FIG. 1 include control signals CS1, CS2, . . . , and CSNas illustrated in FIG. 3A. Each one of the control signals CS1, CS2 . .. , and CSN is configured to control a corresponding switch 310 of theswitches 310, in order to allow the current I1 from the current source320 flow through the corresponding heater segment 300, such that thecorresponding heater segment 300 is conducted accordingly.

FIG. 3B is an exemplary diagram illustrating a part of the configurableheater 130, in the dashed line frame in FIG. 3A, in accordance withvarious embodiments of the present disclosure.

As illustratively shown in FIG. 3B, the first and the second heatersegments 300, the switch 310 disposed therebetween, and the currentsource 320 in FIG. 3A are exemplarily illustrated. The switch 310includes a first transistor 330 and a second transistor 340. In someembodiments, each of the first transistor 330 and the second transistor340 is an N-type metal oxide semiconductor (NMOS) transistor.

In some embodiments, the gates of the first transistor 330 and thesecond transistor 340 are controlled by the same control signal CS1generated by the controller 120. For illustration, the gate of the firsttransistor 330 receives the control signal CS1 through an inverter INV,and the gate of the second transistor 340 receives the control signalCS1 directly. For illustration of operation, when the control signal CS1that controls the first transistor 330 and the second transistor 340 islogic 0, the first transistor 330 is turned on and the second transistor340 is turned off.

Under such a condition, the switch 310 electrically couples the firstheater segment 300 to a ground terminal GND due to the turn-on of thefirst transistor 330. The current I1 generated by the current source 320only flows through the first heater segments 300. As a result, only thefirst heater segment 300 is in operation to generate the heat.

On the other hand, when the corresponding control signal CS1 thatcontrols the first transistor 330 and the second transistor 340 is logic1, the first transistor 330 is turned off and the second transistor 340is turned on.

Under such a condition, the switch 310 electrically couples the firstheater segment 300 to the second heater segment 300 due to the turn-onof the second transistor 340. The current I1 generated by the currentsource 320 flows through both of the first and the second heatersegments 300. As a result, both of the first and the second heatersegments 300 are in operation to generate the heat.

The configuration of the switch 310 in FIG. 3B is given for illustrativepurposes. Various configurations of the switch 310 in FIG. 3B are withinthe contemplated scope of the present disclosure. For example, invarious embodiments, each one of the first transistor 330 and the secondtransistor 340 is implemented by a PMOS transistor, or is implemented bya transmission gate composed of one NMOS transistor and one PMOStransistor.

Based on the above with reference to FIG. 3A and FIG. 3B, the firstheater segment 300 is controlled to be conducted by controlling thecorresponding switch 310 with, for illustration, the control signal CS1.Correspondingly, the heater segments 300 other than the first heatersegment 300 are controlled to be conducted by controlling thecorresponding switches 310 with, for illustration, the respectivecontrol signals CS2-CSN as illustrated in FIG. 3A.

For illustrations above, the number of the heater segments 300 inoperation is trimmable based on the combination of the control signalsCS. As discussed above, the combination of the control signals CS isgenerated by the controller 120 based on the phase difference ΔP.Accordingly, the number of the heater segments 300 in operation istrimmable based on the phase difference ΔP.

The generation of the combination of the control signals CS based on thephase difference ΔP is described in detail in the following paragraphsaccompanied with Table 1.

In some embodiments, the value of the phase difference ΔP is categorizedinto one of a plurality of ranges, in which each of the rangescorresponds to one digital code, and the digital code corresponds to onecombination of the control signals CS.

Table 1 is an exemplary look-up table illustrating the correspondingrelation between the digital codes and the combinations of the controlsignals CS in accordance with various embodiments of the presentdisclosure.

As illustratively shown in Table 1, three bits of the digital codes thatcorresponds to a combination of the control signals that includes sevencontrol signals CS1-CS7 are exemplarily illustrated. The seven controlsignals CS1-CS7 control seven switches 310 labeled as Switch1 to Switch7that correspond to eight heater segments 300.

TABLE 1 Digital Switch1 Switch2 Switch3 Switch4 Switch5 Switch6 Switch7codes (CS1) (CS2) (CS3) (CS4) (CS5) (CS6) (CS7) 000 0 0 0 0 0 0 0 001 00 0 0 0 0 1 010 0 0 0 0 0 1 1 011 0 0 0 0 1 1 1 100 0 0 0 1 1 1 1 101 00 1 1 1 1 1 110 0 1 1 1 1 1 1 111 1 1 1 1 1 1 1

In some embodiments, Switch1 to Switch7 are arranged in the formillustrated in FIG. 3B and each of Switch1 to Switch7 includes NMOStransistors, PMOS transistors, or transmission gates, as discussedabove.

In some embodiments, the digital codes as discussed above correspond tovarious ranges of values of the phase difference ΔP. For illustration, 8digital codes illustratively shown in Table 1 correspond to a firstrange, a second range, . . . , and an eighth range of values of thephase difference ΔP, respectively.

For illustration, when the value of the phase difference ΔP is withinthe first range that corresponds to the digital code “000,” thecontroller 120 generates the control signals CS1-CS7 all having logic 0,as shown in Table 1, such that Switch1 to Switch7 are all turned off. Asa result, only the first heater segment 300 coupled to the currentsource 320 is in operation.

On the other hand, when the value of the phase difference ΔP is withinthe eighth range that corresponds to the digital code “111”, thecontroller 120 generates the control signals CS1-CS7 all having logic 1,as shown in Table 1, such that Switch1 to Switch7 are all turned on. Asa result, eight heater segments 300 are all in operation.

Based on the above, the controller 120 generates various combinations ofthe control signals CS by using the look-up table based on the phasedifference ΔP, in order to trim the number of the heater segments 300 inoperation.

The configuration of the configurable heater 130 in FIG. 3A and theconfiguration of the switch 310 in FIG. 3B are given for illustrativepurposes. Various configurations of the configurable heater 130 in FIG.3A and various configurations of the switch 310 in FIG. 3B are withinthe contemplated scope of the present disclosure.

In some embodiments, the phase difference ΔP indicates that thewavelength of the light Lt transmitted in the photonic component issmaller than the target wavelength, in which the target wavelengthcorresponds to a highest transmission efficiency. Under such acondition, the ambient temperature is able to be increased to modify thewavelength of the light Lt, in order to meet the target wavelength.

For illustration, when the value of the phase difference ΔP increases,the ambient temperature increases accordingly to modify the wavelength,as discussed above. Accordingly, more of the heater segments 300 needsto be conducted and are thus coupled in series through the switches 310to the current source 320, in order to provide more heat.

In some other embodiments, the phase difference ΔP indicates that thewavelength of the light Lt transmitted in the photonic component islarger than the target wavelength. Under such a condition, the ambienttemperature is able to be decreased to modify the wavelength of thelight Lt, in order to meet the target wavelength.

For illustration, when the value of the phase difference ΔP increases,the ambient temperature needs to decrease accordingly to modify thewavelength, as discussed above. Accordingly, less of the heater segments300 needs to be conducted, in order to provide less heat.

FIG. 4 is an exemplary diagram illustrating a relation between the timeand the ambient temperature affected by a heater in accordance withvarious embodiments of the present disclosure.

In some approaches, the heater generates a fixed amount of heat toincrease a fixed temperature at each step. Under such a condition, theambient temperature is increased in a step-wise manner illustrated asthe curve C1 in FIG. 4, in which the amount of an increase 400 intemperature at each step is fixed, as illustrated in FIG. 4. When adifference between a present ambient temperature and a target ambienttemperature increases, a time duration required for the heater togenerate heat to increase the ambient temperature becomes relativelylonger accordingly. With the longer time duration to increase theambient temperature, a longer time duration is required to modify thewavelength of the light Lt to meet the target wavelength, as discussedabove.

Compared to the approaches that increase a fixed temperature at eachstep, as discussed above, by employing the configurable heater 130 asillustrated in the embodiments discussed above, the number of the heatersegments 300 in operation is trimmable based on the phase difference ΔP.When the phase difference ΔP reflects that the difference between thepresent ambient temperature and the target ambient temperatureincreases, more of the heater segments 300 are controlled to be inoperation. Accordingly, the amount of heat is increased rapidly due tomore of the heater segments 300 in operation. For illustration of thecurve C2 in FIG. 4, an increase 410 in temperature at one step isrelatively larger than the increases in temperature at other steps. Withthe increase 410 in temperature, the present ambient temperature isincreased rapidly to meet the target ambient temperature. Accordingly,the wavelength of the light Lt is able to be rapidly modified to meetthe target wavelength. As a result, the transmission of the light Lthaving the target wavelength in the photonic component is moreefficient.

FIG. 5A is an exemplary diagram illustrating another implementation ofthe configurable heater 130 illustrated in FIG. 1, in accordance withvarious embodiments of the present disclosure.

As illustratively shown in FIG. 5A, eight heater segments 300 arearranged as a spiral shape, in which four of the heater segments 300form an outer circle and the other four of the heater segments 300 forman inner circle surrounded by the outer circle.

FIG. 5B is an exemplary diagram illustrating yet another implementationof the configurable heater 130 illustrated in FIG. 1, in accordance withvarious embodiments of the present disclosure.

As illustratively shown in FIG. 5B, eight heater segments 300 arearranged as a cross shape surrounded by a circle shape, in which four ofthe heater segments 300 form the circle shape and the other four of theheater segments 300 form the cross shape surrounded by the circle shape.

In some embodiments, the switch 310 illustrated in FIG. 3B, FIG. 5A orFIG. 5B includes P-type metal oxide semiconductor transistors ortransmission gates. Under such a condition, the corresponding relationbetween the digital codes and the combinations of the control signals CSis different based on the components used in the switch 310.

The configurations of the configurable heater 130 illustrated in FIG. 5Aand FIG. 5B are given for illustrative purposes. Various configurationsof the configurable heater 130 illustrated in FIG. 5A and FIG. 5B arewithin the contemplated scope of the present disclosure.

FIG. 6A is an exemplary cross-sectional diagram illustrating theposition of the configurable heater 130 illustrated in FIG. 1, relativeto a photonic component 600, in accordance with various embodiments ofthe present disclosure.

In some embodiments, the configurable heater 130 and the photoniccomponent 600 are formed in a semiconductor device that includes aplurality of circuit layers, for illustration, including circuit layersL1, L2 and L3 as illustrated in FIG. 6A. The configurable heater 130 andthe photonic component 600 are formed on the same circuit layer L2, inwhich the configurable heater 130 is disposed neighboring to thephotonic component 600.

FIG. 6B is an exemplary cross-sectional diagram illustrating theposition of the configurable heater 130 illustrated in FIG. 1, relativeto the photonic component 600, in accordance with various embodiments ofthe present disclosure.

In some embodiments, the configurable heater 130 and the photoniccomponent 600 are formed in different circuit layers of thesemiconductor device. For illustration in FIG. 6B, the photoniccomponent 600 is disposed on the circuit layer L2, and the configurableheater 130 is disposed on the circuit layer L3 above the circuit layerL2.

FIG. 6C is an exemplary cross-sectional diagram illustrating theposition of the configurable heater 130 illustrated in FIG. 1, relativeto the photonic component 600, in accordance with various embodiments ofthe present disclosure.

In some embodiments, the configurable heater 130 and the photoniccomponent 600 are formed in different circuit layers of thesemiconductor device. For illustration in FIG. 6C, the photoniccomponent 600 is disposed on the circuit layer L2, and the configurableheater 130 is disposed on the circuit layer L1 under the circuit layerL2.

In some embodiments, the photonic component 600 in FIGS. 6A-6C isimplemented by the photonic component 200 in FIG. 2A or the photoniccomponent 220 in FIG. 2B. The positions of the configurable heater 130illustrated in FIG. 1, relative to the photonic component 600,illustrated in FIGS. 6A-6C, are given for illustrative purposes. Variouspositions of the configurable heater 130 illustrated in FIG. 1, relativeto the photonic component 600, are within the contemplated scope of thepresent disclosure.

FIG. 7A is an exemplary cross-sectional diagram illustrating theposition of the heater segment 300 illustrated in FIG. 3A, relative tothe photonic component 600, in accordance with various embodiments ofthe present disclosure.

As illustratively shown in FIG. 7A, the photonic component 600 isdisposed on the circuit layer L2, and the heater segment 300 is disposedon the circuit layer L3 above the circuit layer L2. In some embodiments,the configurable heater 130 in FIG. 1 further includes an assist slice700 and a slice supporter 710 to assist the heat transfer from the layerL3 to the layer L2. In some embodiments, the assist slice 700 is alsoreferred to as a conductor or a heat-conductive segment configured totransfer heat. In some embodiments, the slice supporter 710 is alsoreferred to as a pillar which couples the heater segment 300 to theassist slice 700, as illustrated in FIG. 7A. In some embodiments, bothof the assist slice 700 and the slice supporter 710 are made ofmaterial, including, for example, metal, that is able to transfer heat.

For illustration in FIG. 7A, the assist slice 700 is disposed on thesame circuit layer L2 that the photonic component 600 locates. The slicesupporter 710 is coupled to the assist slice 700 on the circuit layer L2and the heater segment 300 on the circuit layer L3. With such aconfiguration, the slice supporter 710 transfers the heat generated fromthe heater segment 300 to the assist slice 700. The assist slice 700further provides heat to the environment that the photonic component 600locates to increase the ambient temperature of the environment.

FIG. 7B is an exemplary cross-sectional diagram illustrating theposition of the heater segment 300 illustrated in FIG. 3A, relative tothe photonic component 600, in accordance with various embodiments ofthe present disclosure.

As illustratively shown in FIG. 7B, the photonic component 600 isdisposed on the circuit layer L2, and the heater segment 300 is disposedon the circuit layer L1 below the circuit layer L2. In some embodiments,the configurable heater 130 in FIG. 1 further includes the assist slice700 and the slice supporter 710 as discussed above, that are formed toassist the heat transfer from the circuit layer L1 to the circuit layerL2.

For illustration in FIG. 7B, the assist slice 700 is disposed on thesame circuit layer L2 that the photonic component 600 locates. The slicesupporter 710 is coupled to the assist slice 700 on the circuit layer L2and the configurable heater 130 on the circuit layer L1. With such aconfiguration, the slice supporter 710 transfers the heat generated fromthe heater segment 300 to the assist slice 700. The assist slice 700further provides heat to the environment that the photonic component 600locates to increase the ambient temperature of the environment.

The positions of the heater segment 300 illustrated in FIG. 3A, relativeto the photonic component 600, illustrated in FIGS. 7A-7B, are given forillustrative purposes. Various positions of the heater segment 300illustrated in FIG. 3A, relative to the photonic component 600, arewithin the contemplated scope of the present disclosure.

FIG. 8A is an exemplary diagram illustrating a configuration of theconfigurable heater 130 illustrated in FIG. 1, in accordance withvarious embodiments of the present disclosure.

As illustratively shown in FIG. 8A, the configurable heater 130 includesa plurality of heater segments 300, in which the heater segments 300 arestrips disposed parallel to each other. Furthermore, the configurableheater 130 in FIG. 8A also includes the assist slices 700 and the slicesupporters 710 formed either above or below the heater segments 300, asdiscussed above with reference to FIGS. 7A and 7B.

In some embodiments, each of the heater segments 300 extends along a Ydirection, for illustration in FIG. 8A. Each of the assist slices 700extend along an X direction that is substantially orthogonal to the Ydirection, for illustration in FIG. 8A. The number of the assist slices700 and the slice supporters 710 configured with each one of the heatersegments 300 in FIG. 8A is given for illustrative purposes. Variousnumbers of the assist slices 700 and the slice supporters 710 configuredwith each one of the heater segments 300 are within the contemplatedscope of the present disclosure. For example, in various embodiments,there are one assist slice 700 and one slice supporter 710 configuredwith one heater segment 300, and there are two assist slices 700 and twoslice supporters 710 configured with one heater segment 300, asillustrated in FIG. 8A.

FIG. 8B is an exemplary diagram illustrating another configuration ofthe configurable heater 130 illustrated in FIG. 1, in accordance withvarious embodiments of the present disclosure.

As illustratively shown in FIG. 8B, the configurable heater 130 includesa plurality of heater segments 300, in which the heater segments 300 arestrips disposed parallel to each other. Furthermore, the configurableheater 130 in FIG. 8B also includes the assist slices 700 and the slicesupporters 710 formed either above or below the heater segments 300, asdiscussed above with reference to FIGS. 7A and 7B.

In some embodiments, each of the heater segments 300 extends along the Ydirection, for illustration in FIG. 8B. Each of the assist slices 700also extends along the Y direction, for illustration in FIG. 8B. Thenumber of the assist slices 700 and the slice supporters 710 configuredwith each one of the heater segments 300 in FIG. 8B is given forillustrative purposes. Various numbers of the assist slices 700 and theslice supporters 710 configured with each one of the heater segments 300are within the contemplated scope of the present disclosure.

The configurations of the configurable heater 130 illustrated in FIGS.8A-8B are given for illustrative purposes. Various configurations of theconfigurable heater 130 are within the contemplated scope of the presentdisclosure.

FIG. 9 is a flow chart of a configuring method 900 illustrating aconfiguring process of the configurable heating device 100 illustratedin FIG. 1, in accordance with various embodiments of the presentdisclosure.

With reference to the method 900 illustrated in FIG. 9 and theconfigurable heating device 100 illustrated in FIG. 1, in operation 905,the comparator 110 is configured to compare the transmission phase Pt ofthe light Lt transmitted in the photonic component with the referencephase Pr of the reference light Lr to generate the phase difference ΔP.

In operation 910, the controller 120 is configured to generate acombination of control signals CS based on the phase difference ΔP. Asdiscussed above with reference to FIG. 3A, in some embodiments, thecontrol signals CS includes control signals CS1, CS2, . . . , and CSN,and the control signals CS1, CS2, . . . , and CSN are configured tocontrol the corresponding switches 310 to further adjust the number ofthe heat segments 300 in operation.

In operation 915, the number of the heater segments 300 in operation ofthe configurable heater 130 is trimmed according to the control signalsCS.

The number and the order of the operations illustrated in FIG. 9 aregiven for illustrative purposes. Various numbers and the orders of theoperations are within the contemplated scope of the present disclosure.

An aspect of this disclosure relates to a device. The device includes acomparator configured to compare a transmission phase of light in aphotonic component with a reference phase. The device further includes aheater configured to control a temperature of the photonic component.The heater includes a plurality of heater segments, and a plurality ofswitches, wherein each switch of the plurality of switches is between apair of heater segments of the plurality of heater segments. The devicefurther includes a controller configured to control operation of eachswitch of the plurality of switches based on results from the comparatorfor selectively connecting heater segments of the plurality of heatersegments in series. In some embodiments, each heater segment of theplurality of heater segments extends in a first direction. In someembodiments, heater segments of the plurality of heater segments arearranged in a concentric pattern. In some embodiments, a first heatersegment of the plurality of heater segments extends in a firstdirection, and a second heater segment of the plurality of heatersegments extends in a second direction perpendicular to the firstdirection. In some embodiments, a first heater segment of the pluralityof heater segments includes a first portion on a first circuit layer,and a second portion on a second circuit layer, wherein the secondcircuit layer is different from the first circuit layer. In someembodiments, the first heater segment further includes a pillarelectrically connecting the first portion to the second portion.

An aspect of this disclosure relates to a method. The method includescomparing a transmission phase of light in a photonic component with areference phase. The method further includes generating a control signalbased on the comparing. The method further includes selectivelyconnecting heater segments of a heater using the control signal, whereinthe selectively connecting heater segments comprises controlling atleast one switch for selectively connecting the heater segments inseries. In some embodiments, the selecting connecting heater segmentsincludes determining a number of heater segments to connect based on amagnitude of a difference between the transmission phase and thereference phase. In some embodiments, the method further includesselectively connecting heater segments of the heater to ground using thecontrol signal. In some embodiments, the generating the control signalincludes generating a plurality of control signals, and each controlsignal of the plurality of control signals controls a correspondingheater segment of the heater.

An aspect of this description relates to a device. The device includes aphotonic component. The device further includes a heating deviceconfigured to control a temperature of the photonic component. Theheating device includes a comparator configured to compare atransmission phase of light in the photonic component with a referencephase to generate a phase difference signal. The heating device furtherincludes a plurality of heater segments. The heating device furtherincludes a plurality of switches, wherein each switch of the pluralityof switches is between a pair of heater segments of the plurality ofheater segments. The heating device further includes a controllerconfigured to control operation of each switch of the plurality ofswitches based on the phase difference signal for selectively connectingheater segments of the plurality of heater segments. In someembodiments, the photonic component includes a first transmission line;a second transmission line spaced from the first transmission line; anda ring transmission line between the first transmission line and thesecond transmission line. In some embodiments, the ring transmissionline surrounds the plurality of heater segments. In some embodiments,the photonic component includes a first transmission line, wherein thefirst transmission line includes a first segment and a second segment;and a second transmission line, wherein the second transmission lineincludes a third segment and a fourth segment, a first distance betweenthe first segment and the third segment in a first direction isdifferent from a second distance between the third segment and thefourth segment in the first direction. In some embodiments, the seconddistance is less than the first distance. In some embodiments, thesecond segment and the fourth segment are between a first heater segmentof the plurality of heater segments and a second heater segment of theplurality of heater segments. In some embodiments, a first switch of theplurality of switches includes a first transistor configured to receivethe phase difference signal; and a second transistor configured toreceive an inverted signal of the phase difference signal. In someembodiments, the first transistor is configured to selectively connect afirst heater segment of the plurality of heater segments to a secondheater segment of the plurality of heater segments. In some embodiments,the second transistor is configured to selectively connect the firstheater segment to ground. In some embodiments, a first heater segment ofthe plurality of heater segments includes a first portion on a firstcircuit layer; a second portion on a second circuit layer, wherein thesecond circuit layer is different from the first circuit layer; and apillar electrically connecting the first portion to the second portion.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A device comprising: a comparator configured tocompare a transmission phase of light in a photonic component with areference phase; a heater configured to control a temperature of thephotonic component, wherein the heater comprises: a plurality of heatersegments, and a plurality of switches, wherein each switch of theplurality of switches is between a pair of heater segments of theplurality of heater segments; and a controller configured to controloperation of each switch of the plurality of switches based on resultsfrom the comparator for selectively connecting heater segments of theplurality of heater segments in series.
 2. The device of claim 1,wherein each heater segment of the plurality of heater segments extendsin a first direction.
 3. The device of claim 1, where heater segments ofthe plurality of heater segments are arranged in a concentric pattern.4. The device of claim 1, wherein a first heater segment of theplurality of heater segments extends in a first direction, and a secondheater segment of the plurality of heater segments extends in a seconddirection perpendicular to the first direction.
 5. The device of claim1, wherein a first heater segment of the plurality of heater segmentscomprises: a first portion on a first circuit layer; and a secondportion on a second circuit layer, wherein the second circuit layer isdifferent from the first circuit layer.
 6. The device of claim 5,wherein the first heater segment further comprises a pillar electricallyconnecting the first portion to the second portion.
 7. A methodcomprising: comparing a transmission phase of light in a photoniccomponent with a reference phase; generating a control signal based onthe comparing; and selectively connecting heater segments of a heaterusing the control signal, wherein the selectively connecting heatersegments comprises controlling at least one switch for selectivelyconnecting the heater segments in series.
 8. The method of claim 7,wherein the selectively connecting heater segments comprises determininga number of heater segments to connect based on a magnitude of adifference between the transmission phase and the reference phase. 9.The method of claim 7, further comprising selectively connecting heatersegments of the heater to ground using the control signal.
 10. Themethod of claim 7, wherein the generating the control signal comprisesgenerating a plurality of control signals, and each control signal ofthe plurality of control signals controls a corresponding heater segmentof the heater.
 11. A device comprising: a photonic component; and aheating device configured to control a temperature of the photoniccomponent, wherein the heating device comprises: a comparator configuredto compare a transmission phase of light in the photonic component witha reference phase to generate a phase difference signal; a plurality ofheater segments, and a plurality of switches, wherein each switch of theplurality of switches is between a pair of heater segments of theplurality of heater segments; and a controller configured to controloperation of each switch of the plurality of switches based on the phasedifference signal for selectively connecting heater segments of theplurality of heater segments.
 12. The device of claim 11, wherein thephotonic component comprises: a first transmission line; a secondtransmission line spaced from the first transmission line; and a ringtransmission line between the first transmission line and the secondtransmission line.
 13. The device of claim 12, wherein the ringtransmission line surrounds the plurality of heater segments.
 14. Thedevice of claim 11, wherein the photonic component comprises: a firsttransmission line, wherein the first transmission line comprises a firstsegment and a second segment; and a second transmission line, whereinthe second transmission line comprises a third segment and a fourthsegment, a first distance between the first segment and the thirdsegment in a first direction is different from a second distance betweenthe third segment and the fourth segment in the first direction.
 15. Thedevice of claim 14, wherein the second distance is less than the firstdistance.
 16. The device of claim 15, wherein the second segment and thefourth segment are between a first heater segment of the plurality ofheater segments and a second heater segment of the plurality of heatersegments.
 17. The device of claim 11, wherein a first switch of theplurality of switches comprises: a first transistor configured toreceive the phase difference signal; and a second transistor configuredto receive an inverted signal of the phase difference signal.
 18. Thedevice of claim 17, wherein the first transistor is configured toselectively connect a first heater segment of the plurality of heatersegments to a second heater segment of the plurality of heater segments.19. The device of claim 18, wherein the second transistor is configuredto selectively connect the first heater segment to ground.
 20. Thedevice of claim 11, wherein a first heater segment of the plurality ofheater segments comprises: a first portion on a first circuit layer; asecond portion on a second circuit layer, wherein the second circuitlayer is different from the first circuit layer; and a pillarelectrically connecting the first portion to the second portion.